Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection

Gang Zou

Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection
Licentiate thesis, 2003

Author

Gang Zou

Chalmers, Product and Production Development

Other publications Research

Subject Categories

Mechanical Engineering

Avhandling - Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology: 4

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Created

10/7/2017

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