Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection
Licentiatavhandling, 2003

Författare

Gang Zou

Chalmers, Produkt- och produktionsutveckling

Ämneskategorier

Maskinteknik

Avhandling - Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology: 4