Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints

Gang Zou; Hans Grönqvist; Johan Liu

Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints
Journal article, 2004

Author

Gang Zou

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Hans Grönqvist

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

IEEE CPMT Part A

Vol. 27 3 pp 546-550

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints Journal article, 2004