Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Paper in proceeding, 2006
Author
Si Chen
Chalmers, Microtechnology and Nanoscience (MC2)
Peng Sun
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Xiecheng Wei
Zhaonian Cheng
Dongkai Shangguan
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology
368-373
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering