Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive
Paper in proceedings, 2005

Author

Zhaonian Cheng

Lisa Ekstrand

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)

pp139-144

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017