Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive
Paper in proceeding, 2005
Author
Zhaonian Cheng
Lisa Ekstrand
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)
pp139-144
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering