A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers
Paper in proceeding, 2008
Author
Yi Fan
Shanghai University
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems
Yan Zhang
Shanghai University
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems
X. Wang
Shanghai University
Zhaonian Cheng
Chalmers, Microtechnology and Nanoscience (MC2)
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
4607042
978-142442740-6 (ISBN)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICEPT.2008.4607042
ISBN
978-142442740-6