FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
Paper in proceeding, 2009

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.


Nabi Nabiollahi


Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems

Yan Zhang

Shanghai University

Cong Yue

Shanghai University

Zhaonian Cheng

Shanghai University

Masahiro Inoue

Osaka University

2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009

978-981083694-8 (ISBN)

Subject Categories

Mechanical Engineering



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