Zhili Hu

Showing 19 publications

2022

Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites

Yong Zhang, Fei Yang, Chen Yu et al
Journal of Electronic Materials. Vol. 51 (1), p. 420-425
Journal article
2012

Enhanced critical pressure for buckling of carbon nanotubes due to an inserted linear carbon chain

Zhili Hu
Nanotechnology. Vol. 19 (30), p. 305703-
Journal article
2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Journal article
2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Journal article
2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Journal article
2011

Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Y. Zhang, Zhili Hu, L. Ye et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 506-509
Paper in proceeding
2011

Numerical study of thermal transfer between adhesive and CNTs

Yan Zhang, Shun Wang, Zhili Hu et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 133 - 137
Paper in proceeding
2011

Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures

Yan Zhang, Shun Wang, Shiwei Ma et al
CD proceedings of IMAPS Poland 2011
Paper in proceeding
2011

Influence of substrate on electrical conductivity of isotropic conductive adhesive

Zhili Hu, Wenhui Du, Cong Yue et al
Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 330 - 335
Paper in proceeding
2011

The effect of functionalized silver on properties of conductive adhesives

Q. Fan, H. Cui, D. Li et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 423-425
Paper in proceeding
2011

Molecular Gun Composed of Carbon Nanotube

Zhili Hu, X. Guo, Johan Liu
Journal of Computational and Theoretical Nanoscience. Vol. 8 (9), p. 1716-1719
Journal article
2010

MDS study on the adhesive heat transfer in micro-channel cooler

Shun Wang, Y. Zhang, Zhili Hu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583859), p. 630-633
Paper in proceeding
2010

The effect of modulus on the performance of thermal conductive adhesives

Zhili Hu, Cong Yue, X. Guo et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582884), p. 648-651
Paper in proceeding
2010

The Effect of Boundary Conditions on a Theoretical Analysis of Axial Buckling in a Chiral Single-Wall Carbon Nanotube

Zhili Hu, X. Guo
Journal of Computational and Theoretical Nanoscience. Vol. 7 (11), p. 2401-2404
Journal article
2009

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Zhili Hu, Björn Carlberg, Cong Yue et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 481-484
Paper in proceeding
2009

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Cong Yue, Yan Zhang, Zhili Hu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 851-855
Paper in proceeding
2009

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Nabi Nabiollahi, Johan Liu, Zhili Hu et al
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009, p. 422-425
Paper in proceeding
2008

Vibration and Bucling of a carbon nanotbue inserted with a carbon chain

Zhili Hu, Ximing Guo, Johan Liu
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-09
Paper in proceeding

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