Molecular dynamics simulation for the bonding energy of metal-SWNT interface
Paper in proceeding, 2011

For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.


Y. Zhang

Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems

L. Ye

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011

978-145771768-0 (ISBN)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering





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