Molecular dynamics simulation for the bonding energy of metal-SWNT interface
Paper i proceeding, 2011
Författare
Y. Zhang
Zhili Hu
Chalmers, Teknisk fysik, Elektronikmaterial
L. Ye
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011
506-509
978-145771768-0 (ISBN)
Ämneskategorier
Elektroteknik och elektronik
DOI
10.1109/ICEPT.2011.6066886
ISBN
978-145771768-0