Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications
Paper in proceedings, 2009

Author

Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Björn Carlberg

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Cong Yue

Xingming Guo

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

481-484

Subject Categories

Materials Engineering

More information

Created

10/6/2017