Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications
Paper in proceeding, 2009
Author
Zhili Hu
Chalmers, Applied Physics, Electronics Material and Systems
Björn Carlberg
Chalmers, Applied Physics, Electronics Material and Systems
Cong Yue
Xingming Guo
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
481-484
Subject Categories (SSIF 2011)
Materials Engineering