The effect of functionalized silver on properties of conductive adhesives
Paper in proceedings, 2011

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

Author

Q. Fan

Shanghai University

H. Cui

Shanghai University

D. Li

Shanghai University

Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Z. Yuan

Shanghai University

L. Ye

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011

423-425

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/ICEPT.2011.6066868

ISBN

978-145771768-0

More information

Latest update

7/17/2019