The effect of functionalized silver on properties of conductive adhesives
Paper i proceeding, 2011
Författare
Q. Fan
Shanghai University
H. Cui
Shanghai University
D. Li
Shanghai University
Zhili Hu
Chalmers, Teknisk fysik, Elektronikmaterial
Z. Yuan
Shanghai University
L. Ye
Chalmers, Teknisk fysik, Elektronikmaterial
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011
423-425
978-145771768-0 (ISBN)
Ämneskategorier
Elektroteknik och elektronik
DOI
10.1109/ICEPT.2011.6066868
ISBN
978-145771768-0