The effect of functionalized silver on properties of conductive adhesives
Paper i proceeding, 2011

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.


Q. Fan

Shanghai University

H. Cui

Shanghai University

D. Li

Shanghai University

Zhili Hu

Chalmers, Teknisk fysik, Elektronikmaterial

Z. Yuan

Shanghai University

L. Ye

Chalmers, Teknisk fysik, Elektronikmaterial

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial

Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011

978-145771768-0 (ISBN)


Elektroteknik och elektronik





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