A Theoretical Study of Carbon Nanotubes in Electronic Packaging Applications
Doctoral thesis, 2012
simulation
thermal interface material
continuum
electronic packaging
MDs
CNT
Author
Zhili Hu
Chalmers, Applied Physics, Electronics Material and Systems
MDS study on the adhesive heat transfer in micro-channel cooler
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010,;(2010)p. 630-633
Paper in proceeding
Molecular Gun Composed of Carbon Nanotube
Journal of Computational and Theoretical Nanoscience,;Vol. 8(2011)p. 1716-1719
Journal article
Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon
Applied Physics Letters,;Vol. 101(2012)p. Art. no. 133105-
Journal article
The Effect of Boundary Conditions on a Theoretical Analysis of Axial Buckling in a Chiral Single-Wall Carbon Nanotube
Journal of Computational and Theoretical Nanoscience,;Vol. 7(2010)p. 2401-2404
Journal article
Enhanced critical pressure for buckling of carbon nanotubes due to an inserted linear carbon chain
Nanotechnology,;Vol. 19(2012)p. 305703-
Journal article
Molecular dynamics simulation for the bonding energy of metal-SWNT interface
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011,;(2011)p. 506-509
Paper in proceeding
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Infrastructure
C3SE (Chalmers Centre for Computational Science and Engineering)
Subject Categories
Atom and Molecular Physics and Optics
ISBN
9789173857857
Technical report MC2 - Department of Microtechnology and Nanoscience, Chalmers University of Technology
Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 3466
kollektorn
Opponent: Prof. Bernhard Wunderle,Lehrstuhl Werkstoffe und Zuverlässigkeit Mikrotechnischer Systeme Fakultät für Elektrotechnik und Informationstechnik,Technische Universität Chemnitz,Germany