Numerical study of thermal transfer between adhesive and CNTs
Paper in proceedings, 2011

Author

Yan Zhang

Shun Wang

Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15

133 - 137

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Materials Science

Subject Categories

Materials Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017