Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Paper in proceeding, 2009
Author
Li Xu
Xiuzhen Lu
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Du Xinyu
Yan Zhang
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1051-1053
Subject Categories
Materials Engineering