Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Paper in proceedings, 2009

Author

Li Xu

Xiuzhen Lu

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Du Xinyu

Zhaonian Cheng

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

1051-1053

Subject Categories

Materials Engineering

More information

Created

10/7/2017