Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Paper i proceeding, 2009
Författare
Li Xu
Xiuzhen Lu
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Du Xinyu
Yan Zhang
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1051-1053
Ämneskategorier
Materialteknik