Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Paper i proceeding, 2009

Författare

Li Xu

Xiuzhen Lu

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Du Xinyu

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

1051-1053

Ämneskategorier

Materialteknik