Yan Zhang
Visar 47 publikationer
Experimental Study on the Mechanical Reliability of Carbon Nanotubes
Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
Reliability of Carbon Nanotube Bumps for Chip on Film Application
Characterization for Graphene as Heat Spreader Using Thermal Imaging Method
Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive
FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Mobile mini-DOAS measurement of the outflow of NO2 and HCHO from Mexico City
Homogenization of Delamination Growth in an ACA Flip-chip Joint Based on Micropolar Theory
A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink
Tomographic reconstruction of gas plumes using scanning DOAS
Validation of optical remote sensing measurement strategies applied to industrial gas emissions
Understanding BGA interconnect interface behaviour using Micropolar theory
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects
Encapsulation of OLED device by Using Anisotropic Conductive Adhesive
Homogenization of microsystem interconnects based on micropolar theory and discontinuous kinematics
Micropolar Delamination Modelling for ACF Flip-chip Joints in Microsystem
Modelling and Reliability Assessment of Microsystem Interconnections
Second order multi-scale micropolar model for microsystem interconnections
PBGA Interconnect Behavior under Thermal Effects
A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
Development and Implementation of a Wireless Sensor Network for Volcanic Gas Emission Monitoring
Interface Modelling of ACA Interconnects Using Micropolar Theory
Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection
Higher Order Homogenization of a Microsystem Interface Based on Micropolar Theory
Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling
Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling
Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
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