Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model
Paper i proceeding, 2009
Författare
Yan Zhang
Jinyu Fan
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
160-163
Ämneskategorier
Maskinteknik