Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model
Paper i proceeding, 2009

Författare

Jinyu Fan

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

160-163

Ämneskategorier

Maskinteknik