Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model
Paper in proceedings, 2009

Author

Jinyu Fan

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

160-163

Subject Categories

Mechanical Engineering

More information

Created

10/6/2017