Interface Modelling of ACA Interconnects Using Micropolar Theory
Paper i proceeding, 2006

The contribution focuses on applying micro-polar theory which, as compared to the classical continuum theory, can offer the possiblity to include e.g. a micro-structural size-effect for the simulation and prediction of the interfacial stresses of microsystem interconnections, such as anisotropically conductive adhesives. As the dimension of the adhesive is much smaller than the chip or the substrate, it is treated as an interface zone with a finite thickness. The micro-polar theory is used in the vicinity of the interface to model the transfer of the couple stress across the interface, and a degenerated micro-polar continuum to model the interface, across which a displacement and a rotational jump is regularized. The paper is concluded by a numerical example involving the FE-representation of the interface formulation.


Yan Zhang

Chalmers, Tillämpad mekanik, Material- och beräkningsmekanik

Ragnar Larsson

Chalmers, Tillämpad mekanik, Material- och beräkningsmekanik

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05; Shanghai; China; 27 June 2005 through 29 June 2005

Art. no. 4017426-
978-078039293-9 (ISBN)


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