Experimental Study on the Mechanical Reliability of Carbon Nanotubes
Paper i proceeding, 2013

Robust and reliable interconnect and effective heat management are two major concerns in the high-speed and high-power integrated circuit. Carbon nanotube (CNT) exhibits amazing mechanical, thermal and electronic properties due to the unique structure. Those superior features make CNTs preferable and promising for application in electronic components and devices. In the present paper, carbon nanotube bundles with an array pattern are fabricated, and then their mechanical strength and reliability are investigated experimentally. Different pressure loadings are applied on the surfaces of the CNT bundles and their deformation during loading process are observed. Furthermore, the responses of the CNT bundles under airflow impingement are studied. Various damage modes occur in the different loading conditions.

Författare

Yan Zhang

Shanghai University

Ling Wang

Shanghai University

Jingyu Fan

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT)

105-108

Styrkeområden

Nanovetenskap och nanoteknik

Ämneskategorier

Nanoteknik

DOI

10.1109/ICEPT.2013.6756433

ISBN

9781479904990