Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler
Paper i proceeding, 2012
Författare
Yan Zhang
Shanghai University
Huifeng Lv
Shanghai University
Jing-yu Fan
Shanghai University
Di Jiang
Chalmers, Teknisk fysik, Elektronikmaterial
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging
1573-1577
978-146731680-4 (ISBN)
Ämneskategorier
Annan elektroteknik och elektronik
DOI
10.1109/ICEPT-HDP.2012.6474907
ISBN
978-146731680-4