Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler
Paper in proceeding, 2012
Author
Yan Zhang
Shanghai University
Huifeng Lv
Shanghai University
Jing-yu Fan
Shanghai University
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging
1573-1577
978-146731680-4 (ISBN)
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICEPT-HDP.2012.6474907
ISBN
978-146731680-4