Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler
Paper in proceeding, 2012

The current development of electronic products towards miniaturization and multifunction is leading to an increase in the power density of chip and IC. The high power consumption and corresponding heat dissipation are two of the most serious limitations for high performance electronics. The combination of the carbon nanotube (CNT) with outstanding thermal properties with an air jet cooling provides a promising option for the heat dissipation of high-powered components and devices. In the present paper, the CNTs are utilized to manufacture the pin-fins for the micro-cooler, and the performance and evaluation of this CNT-based micro-pin-fin cooler are investigated both experimentally and numerically. The effects of various parameters, such as the jet velocity and height, the fin size and shape, and so on, on the flow field and temperature distribution characteristics are comprehensively considered and analyzed. The obtained results indicate that the CNT-fins are of quite good strength and thermal performance in the jet impingement cooling environment. © 2012 IEEE.


Yan Zhang

Shanghai University

Huifeng Lv

Shanghai University

Jing-yu Fan

Shanghai University

Di Jiang

Chalmers, Applied Physics, Electronics Material and Systems

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging

978-146731680-4 (ISBN)

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering





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