A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink
Paper in proceeding, 2009
Author
Shun Wang
Yan Zhang
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems
X Wang
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
255-259
Subject Categories
Mechanical Engineering