A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink
Paper in proceedings, 2009

Author

Shun Wang

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

X Wang

Zhaonian Cheng

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

255-259

Subject Categories

Mechanical Engineering

More information

Created

10/6/2017