Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
Paper in proceedings, 2009

Author

Xiuzhen Lu

Li Xu

Huaxiang Lai

Xinyu Du

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Zhaonian Cheng

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

1051-1053

Subject Categories

Materials Engineering

More information

Created

10/7/2017