Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
Paper i proceeding, 2009

Författare

Xiuzhen Lu

Li Xu

Huaxiang Lai

Xinyu Du

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

1051-1053

Ämneskategorier

Materialteknik

Mer information

Skapat

2017-10-07