Application of two-dimensional layered hexagonal boron nitride in chip cooling
Artikel i vetenskaplig tidskrift, 2016

© 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.

Boron nitride

Single layer

Thermal evaluation chip

Heat dissipation


Jie Bao

Huangshan University

Shanghai University

Y. Zhang

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

Shanghai University

S. Huang

Shanghai University

Shuangxi Sun

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

X. Lu

Shanghai University

Yifeng Fu

SHT Smart High-Tech

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering

1005-0930 (ISSN)

Vol. 24 1 210-217


Elektroteknik och elektronik



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