Application of two-dimensional layered hexagonal boron nitride in chip cooling
Journal article, 2016
© 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.
Boron nitride
Single layer
Thermal evaluation chip
Heat dissipation
Author
Jie Bao
Huangshan University
Shanghai University
Y. Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Shanghai University
S. Huang
Shanghai University
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
X. Lu
Shanghai University
Yifeng Fu
SHT Smart High-Tech
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering
1005-0930 (ISSN)
Vol. 24 1 210-217Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.16058/j.issn.1005-0930.2016.01.020