Boron nitride
Single layer
Heat dissipation
Thermal evaluation chip
Huangshan University
Shanghai University
Shanghai University
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Shanghai University
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Shanghai University
SHT Smart High-Tech
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
1005-0930 (ISSN)
Vol. 24 1 210-217Electrical Engineering, Electronic Engineering, Information Engineering
10.16058/j.issn.1005-0930.2016.01.020