Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
Paper in proceeding, 2014

In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation but still represent a bottleneck in the total thermal resistance of the system. VA-CNTs mats are typically grown on HR silicon substrate with Al2O3 diffusion barrier layer using Thermal CVD process. In many cases, 'die attach' thermal interface materials need to be electrically conductive and the growth of dense VA-CNT mats on an electrically conductive substrate remains a challenge. This paper presents the growth of dense VA-CNT mats on doped silicon with Al2O3 and TiN diffusion barrier layer. Processes, thermal and electrical characterization of VA-CNTs based thermal interface materials are studied and reported.

Author

J. Daon

Thales Group

Ecole Centrale Paris

Shuangxi Sun

Chalmers, Applied Physics, Electronics Material and Systems

Di Jiang

Chalmers, Applied Physics, Electronics Material and Systems

G. Cibien

Thales Group

E.M. Leveugle

Thales Group

C. Galindo

Thales Group

A. Ziaei

Thales Group

L. Ye

SHT Smart High-Tech

Yifeng Fu

SHT Smart High-Tech

J. Bai

Ecole Centrale Paris

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014

6972534
978-1-4799-5415-5 (ISBN)

Subject Categories

Materials Engineering

DOI

10.1109/THERMINIC.2014.6972534

ISBN

978-1-4799-5415-5

More information

Latest update

3/25/2020