A solder joint structure with vertically aligned carbon nanofibres as reinforcements
Paper in proceeding, 2014
Author
S. Chen
Chalmers, Applied Physics, Electronics Material and Systems
Shanghai University
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
Art. no. 6962851-
978-147994026-4 (ISBN)
Subject Categories
Nano Technology
DOI
10.1109/ESTC.2014.6962851
ISBN
978-147994026-4