Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
Paper in proceeding, 2012
LOW-TEMPERATURE
CHEMICAL-VAPOR-DEPOSITION
GROWTH
THROUGH-SILICON
DENSE
FILMS
Author
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems
Lilei Ye
SHT Smart High-Tech
Kjell Jeppson
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
ECS Transactions
19385862 (ISSN) 19386737 (eISSN)
Vol. 44 1 683-692978-1-60768-318-6 (ISBN)
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1149/1.3694387
ISBN
978-1-60768-318-6