Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
Journal article, 2012
carbon nanotubes
3D integration
through-silicon-vias
Author
Kjell Jeppson
Chalmers, Applied Physics, Electronics Material and Systems
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems
Lilei Ye
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
IEEE Electron Device Letters
0741-3106 (ISSN) 15580563 (eISSN)
Vol. 33 3 420-422 6138280Areas of Advance
Information and Communication Technology
Driving Forces
Sustainable development
Roots
Basic sciences
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/LED.2011.2177804