Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
Paper in proceeding, 2013

With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of the CNT interconnects were measured, and the thermal and humidity test were conducted. In addition, the CNT forests on fine pitch copper lines under various environmental test conditions were observed to evaluate the stability. © 2013 IEEE.


Yan Zhang

Shanghai University

Yingjie Zhou

Shanghai University

Jingyu Fan

Shanghai University

Di Jiang

Chalmers, Applied Physics, Electronics Material and Systems

Yifeng Fu

SHT Smart High-Tech

Shiwei Ma

Shanghai University

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Proceedings of the IEEE Conference on Nanotechnology

19449399 (ISSN) 19449380 (eISSN)

978-147990675-8 (ISBN)

Areas of Advance

Nanoscience and Nanotechnology


Subject Categories

Nano Technology





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