Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
Paper in proceeding, 2013
Author
Yan Zhang
Shanghai University
Yingjie Zhou
Shanghai University
Jingyu Fan
Shanghai University
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems
Yifeng Fu
SHT Smart High-Tech
Shiwei Ma
Shanghai University
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the IEEE Conference on Nanotechnology
19449399 (ISSN) 19449380 (eISSN)
1085-1088978-147990675-8 (ISBN)
Areas of Advance
Nanoscience and Nanotechnology
Production
Subject Categories
Nano Technology
DOI
10.1109/NANO.2013.6720972
ISBN
978-147990675-8