Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film
Paper in proceedings, 2010

Carbon Nanotube (CNT) has been proposed as a promising candidate material to build next generation flip chip interconnects in electronics. In this paper, flip chip assembly using CNT bumps and ACF is performed. To realize CNT-based interconnects, post-growth processes including deposition of metallic layers on CNT bundles and low temperature transfer of CNT bundles have been developed to overcome the problems of the high growth temperature of CNT as well as the poor adhesion between CNT bumps and substrates. Moreover, ACF has been used to assemble the CNT bumps on another Si substrate. The electrical test is performed also to verify the good contact between CNT bumps and ACF.

Author

Xia Zhang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Pär Berggren

SHT Smart High-Tech

Si Chen

Shanghai University

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

ECS Transactions

1938-5862 (ISSN) 1938-6737 (eISSN)

Vol. 27 1 825-830

Subject Categories

Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1149/1.3360717

ISBN

978-160768263-9

More information

Latest update

3/7/2018 7