Xia Zhang

Showing 13 publications

2010

Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates

Xia Zhang, X. Yan, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 31 (4), p. 469-480
Journal article
2010

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang, Teng Wang, Pär Berggren et al
ECS Transactions. Vol. 27 (1), p. 825-830
Paper in proceedings
2009

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 30 (2), p. 183-189
Journal article
2009

A Compact Ultra-Wideband Bandpass Filter with Ultra-Fine Conductor Trace based on Liquid Crystal Polymer Substrates

Xia Zhang, Johan Liu, Camilla kärnfeldt et al
Circuit World. Vol. 35 (1), p. 16-21
Journal article
2008

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 163-167
Paper in proceedings
2008

RF Performance of Flip Chip ACA Joints for CPW Transmission Lines

Xu Wang, Xia Zhang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 501-506
Paper in proceedings
2008

Overview of Carbon Nanotubes as Off-Chip Interconnects

Xia Zhang, Teng Wang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference
Paper in proceedings
2008

Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems

Xia Zhang, Johan Liu, Peng Cai et al
Journal of Microwave and Optical Technology Letters, p. 2276-2280
Journal article
2007

Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application

Xia Zhang, Herbert Zirath, Johan Liu
International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceedings
2006

Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications

Xia Zhang
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Conference contribution
2006

Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications

Xia Zhang, Qi Zhang, Gang Zou et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 118-125
Paper in proceedings

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