Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications
Conference contribution, 2006

Author

Xia Zhang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Subject Categories

Other Materials Engineering

More information

Created

10/6/2017