Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application
Paper in proceeding, 2007
Author
Xia Zhang
Chalmers, Microtechnology and Nanoscience (MC2)
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2)
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering