Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly
Journal article, 2010

An indium-assisted ultrafast carbon nanotube (CNT) transfer method with a yield rate over 90% is described. Metal-coated as-transferred CNT structures exhibit excellent electrical performance that is at least one order of magnitude better than the previously published results. Shear test results show that the adhesion between CNTs and the substrate is greatly improved and excellent flexibility is obtained after the transfer process.

Author

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yiheng Qin

Chalmers, Microtechnology and Nanoscience (MC2)

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Si Chen

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Advanced Materials

0935-9648 (ISSN)

Vol. 22 44 5039-5042

Areas of Advance

Information and Communication Technology

Nanoscience and Nanotechnology

Materials Science

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1002/adma.201002415

More information

Created

10/8/2017