Study on the reliability of fast curing isotropic conductive adhesive
Paper in proceedings, 2011

Author

Wenhui Du

Huiwang Cui

Zhichao Yuan

Lilei Ye

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

ECS Transactions

Vol. 34 1 805 - 810

Subject Categories

Materials Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Materials Science

More information

Created

10/8/2017