Björn Carlberg

Publikationer (29)
Projekt (0)

Visar 29 publikationer

2012

Thermal performance characterization of nano thermal interface materials after power cycling

S. Sun, L. Xin, Carl Zandén et al

Proceedings - Electronic Components and Technology Conference, p. 1426-1430

Paper i proceeding

2012

A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications

Patric Wallin, Carl Zandén, Björn Carlberg et al

Biomicrofluidics. Vol. 6 (2)

Artikel i vetenskaplig tidskrift

2012

Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments

Patric Wallin, Carl Zandén, Björn Carlberg et al

eCM Journal. Vol. 23 (Supplement 5), p. 65-

Poster (konferens)

2012

Polymer-metal nanofibrous composite for thermal management of microsystems

Björn Carlberg, L. Ye, Johan Liu

Materials Letters. Vol. 75, p. 229-232

Artikel i vetenskaplig tidskrift

2012

Integration of Nanofibrous Materials in Microsystem Applications – Process Development and Characterization

Björn Carlberg

Doktorsavhandling

2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al

Nanotechnology. Vol. 23 (4)

Artikel i vetenskaplig tidskrift

2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al

Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176

Paper i proceeding

2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al

Proceedings of the IEEE Conference on Nanotechnology

Paper i proceeding

2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al

Advanced Materials. Vol. 24 (12), p. 1576-1581

Artikel i vetenskaplig tidskrift

2011

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

L. Zhang, X. Lu, Xin Luo et al

Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429

Paper i proceeding

2011

Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers

Björn Carlberg, L. Ye, Johan Liu

Small. Vol. 7 (21), p. 3057-3066

Artikel i vetenskaplig tidskrift

2010

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Björn Carlberg, Teng Wang, Johan Liu

Langmuir. Vol. 26 (4), p. 2235-2239

Artikel i vetenskaplig tidskrift

2010

Polymer nanofiber based continuous metal phase composite for thermal management applications

Björn Carlberg, Johan Liu, L. Ye

3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010, p. Art. no. 5642950-

Paper i proceeding

2010

Interpenetrating phase polymer-metal composite for thermal interface material applications

Björn Carlberg, Johan Liu

IEEE CPMT Electronics System Integration Conference (ESTC)

Övrigt konferensbidrag

2010

Nanofiber based composites for thermal management

Johan Liu, Björn Carlberg

International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference

Övrigt konferensbidrag

2009

Integration of Electrospun Materials in Microelectronic and Biomedical Applications

Björn Carlberg

Licentiatavhandling

2009

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Björn Carlberg, Mathilda Zetterström Axell, Ulf Nannmark et al

Biomedical Materials (Bristol). Vol. 4 (4), p. 45004-

Artikel i vetenskaplig tidskrift

2009

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Zhili Hu, Björn Carlberg, Cong Yue et al

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 481-484

Paper i proceeding

2009

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Johan Liu, Hans-Georg Kuhn, Jing Yujia et al

Proceedings of the 2009 Electronic Components and Technology Conference, p. 1080-1085

Paper i proceeding

2009

Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance

Carl Zandén, Björn Carlberg, Johan Liu

Proceedings of the The International 3rd Swedish Production Symposium (SPS), p. 88-96

Paper i proceeding

2009

Polymer-metal nano-composite films for thermal management

Björn Carlberg, Teng Wang, Johan Liu et al

Microelectronics International. Vol. 26 (2), p. 28-36

Artikel i vetenskaplig tidskrift

2008

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Björn Carlberg, Teng Wang, Yifeng Fu et al

proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197

Paper i proceeding

2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al

Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47

Kapitel i bok

2008

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Björn Carlberg, Teng Wang, Yifeng Fu et al

Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400

Paper i proceeding

2008

Recent Progress of Thermal Interface Materials

Johan Liu, Teng Wang, Björn Carlberg et al

Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 351-358

Paper i proceeding

2007

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Teng Wang, Björn Carlberg, Martin Jonsson et al

Applied Physics Letters. Vol. 91 (9), p. 093123-

Artikel i vetenskaplig tidskrift

2007

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Björn Carlberg, Johan Liu

Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007

Paper i proceeding

2007

Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material

Johan Liu, Björn Carlberg

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Paper i proceeding

2007

Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications

Björn Carlberg, Jonas Norberg, Johan Liu

proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)

Paper i proceeding

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