Graphene-based heat spreading materials for electronics packaging applications
Paper i proceeding, 2017
Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.
graphene-based electrically conductive adhesive
electronics packaging
graphene-based film
heat spreading materials
Författare
G. Yuan
Shanghai University
B. Shan
Shanghai University
S. Chen
Shanghai University
Y. Yang
Shanghai University
Jie Bao
Shanghai University
Nan Wang
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
Peng Su
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
S. Huang
Shanghai University
Y. Zhang
Shanghai University
L. Ye
SHT Smart High-Tech
Shanghai University
Johan Liu
Shanghai University
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017
172-174
978-1-5386-3055-6 (ISBN)
Ämneskategorier
Materialkemi
DOI
10.1109/NORDPAC.2017.7993187
ISBN
978-1-5386-3055-6