Graphene-based heat spreading materials for electronics packaging applications
Paper i proceeding, 2017

Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.

graphene-based electrically conductive adhesive

electronics packaging

graphene-based film

heat spreading materials

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Publicerad i

2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017

s. 172-174
978-1-5386-3055-6 (ISBN)

Kategorisering

Ämneskategorier (SSIF 2011)

Materialkemi

Identifikatorer

DOI

10.1109/NORDPAC.2017.7993187

ISBN

978-1-5386-3055-6

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Senast uppdaterat

2018-09-21