Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
Paper in proceeding, 2016
The design, fabrication, and use of a hotspot-producing and temperature-sensing test structure for evaluating the thermal properties of carbon nanotubes, graphene and boron nitride for cooling of electronic devices in applications like 3D integrated chip-stacks, power amplifiers and light-emitting diodes is described. The test structure is a simple meander-shaped metal resistor serving both as the hotspot and the temperature thermo-meter. By use of this test structure, the influence of emerging materials like those mentioned above on the temperature of the hotspot has been evaluated with good accuracy).
test structures
resistance temperature detectors
hotspots
graphene
heat spreaders
boron nitride
Author
Kjell Jeppson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Jie Bao
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
S. Huang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
Yong Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016
1071-9032 (ISSN)
32-36Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)
European Commission (EC) (EC/H2020/690896), 2016-01-01 -- 2018-12-31.
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICMTS.2016.7476169