Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
Paper in proceedings, 2016

The design, fabrication, and use of a hotspot-producing and temperature-sensing test structure for evaluating the thermal properties of carbon nanotubes, graphene and boron nitride for cooling of electronic devices in applications like 3D integrated chip-stacks, power amplifiers and light-emitting diodes is described. The test structure is a simple meander-shaped metal resistor serving both as the hotspot and the temperature thermo-meter. By use of this test structure, the influence of emerging materials like those mentioned above on the temperature of the hotspot has been evaluated with good accuracy).

test structures

resistance temperature detectors

hotspots

graphene

heat spreaders

boron nitride

Author

Kjell Jeppson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Jie Bao

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shanghai University

S. Huang

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shanghai University

Yong Zhang

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shuangxi Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016

1071-9032 (ISSN)

32-36

Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)

European Commission (Horizon 2020), 2016-01-01 -- 2018-12-31.

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/ICMTS.2016.7476169

More information

Latest update

9/25/2019