Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
Journal article, 2018

Graphene and carbon nanotubes have received much attention for thermal management application due to their unique thermal performance. Theoretical work suggests that a covalent bond can combine 1D carbon nanotubes with 2D graphene together to extend the excellent thermal property to three dimensions for heat dissipation. This paper experimentally demonstrates the high heat dissipation capability of a freestanding 3D multiwall carbon nanotube (MWCNT) and graphene hybrid material. Using high-resolution transmission electron microscopy and pulsed photothermal reflection measurement method, the covalent bonds between MWCNT and planar graphene are microscopically and numerically demonstrated. Thermal resistance at the junction with covalent bonds is 9×10^−10 Kelvin square meter per watt, which is three orders of magnitude lower than van der Waals contact. Joule heating method is used to verify the extra cooling effect of this 3D hybrid material compared to graphite film. A demonstrator using high power chip is developed to demonstrate the applicability of this hybrid material in thermal application. Temperature at hot spots can be decreased by around 10°C with the assistance of this hybrid material. These findings are very significant for understanding the thermal conduction during combining 1D and 2D carbon material together for future thermal management application.

Graphene

thermal management

heat dissipation

Multiwall carbon nanotubes

Author

Majid Kabiri Samani

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shuangxi Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

T Xu

Southeast University

Ye Lilei

SHT Smart High-Tech

Maulik Satwara

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Kjell Jeppson

Chalmers, Computer Science and Engineering (Chalmers), Computer Engineering (Chalmers)

Torbjörn Nilsson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

L Sun

Southeast University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Advanced Materials Interfaces

2196-7350 (eISSN)

Vol. 2018 5 1800318

Carbon Based High Speed 3D GaN Electronics System

Swedish Foundation for Strategic Research (SSF), 2014-03-01 -- 2019-06-30.

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Production

Subject Categories

Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

Nano Technology

DOI

10.1002/admi.201800318

More information

Latest update

8/31/2018