Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
Journal article, 2018
heat dissipation
thermal management
Multiwall carbon nanotubes
Graphene
Author
Majid Kabiri Samani
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
T Xu
Southeast University
Ye Lilei
SHT Smart High-Tech
Maulik Satwara
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Kjell Jeppson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Torbjörn Nilsson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
L Sun
Southeast University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Advanced Materials Interfaces
2196-7350 (eISSN)
Vol. 5 15 1800318Carbon Based High Speed 3D GaN Electronics System
Swedish Foundation for Strategic Research (SSF) (SE13-0061), 2014-03-01 -- 2019-06-30.
Areas of Advance
Nanoscience and Nanotechnology
Production
Subject Categories
Materials Engineering
Electrical Engineering, Electronic Engineering, Information Engineering
Nano Technology
DOI
10.1002/admi.201800318