Thermal properties of TIM using CNTs forest in electronics packaging
Paper in proceedings, 2016

Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was analyzed. Vertically aligned carbon nanotubes with length of 245?m and 763?m were synthesized on a silicon substrate by chemical vapor deposition respectively. Morphology of the vertically aligned carbon nanotubes was characterized by scanning electron microscope. The hotspot temperature of thermal test chip with vertically aligned carbon nanotubes were characterized by resistance temperature detector method and infrared imaging method.

resistance temperature detector




thermal test chip



Dongsheng Zhang

Shanghai University

Jiawen Liu

Shanghai University

Johan Liu

Shanghai University

Shuangxi Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shirong Huang

Shanghai University

Jie Bao

Shanghai University

N. Wang

Shanghai University

Xiuzhen Lu

Shanghai University

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016


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Materials Chemistry

Other Materials Engineering



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