Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips
Paper in proceeding, 2014
IR
thermal measurement
RTD
Author
Yan Zhang
Shanghai University
C. He
Shanghai University
Yong Zhang
Shanghai University
Yifeng Fu
SHT Smart High-Tech
J. Fan
Shanghai University
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014
1507-1511
978-147994707-2 (ISBN)
Subject Categories
Nano Technology
DOI
10.1109/ICEPT.2014.6922940
ISBN
978-147994707-2