Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips
Paper in proceedings, 2014

In the present paper, a chip with a Pt-based RTD that functions as a heater and sensor is tested under serial power loads, and infrared (IR) thermal imaging system is adopted to obtain the thermal measurement. Comparisons of the hotspot temperatures of the chip obtained by RTD and IR methods have been made, where different surfaces of the chip were observed by the IR camera. Combing with the heat conduction law, the IR results of the test chip with surface preparation showed quite a good agreement with the RTD data, verifying the validation of the IR analysis method.


thermal measurement



Yan Zhang

Shanghai University

C. He

Shanghai University

Yong Zhang

Shanghai University

Yifeng Fu

SHT Smart High-Tech

J. Fan

Shanghai University

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014

978-147994707-2 (ISBN)

Subject Categories

Nano Technology





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