Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Paper in proceedings, 2012

Monolayer graphene was fabricated using thermal CVD for the application of heat spreader in electronic packaging. Platinum (Pt) micro-heater embedded thermal testing chips were utilized to evaluate the thermal performance of the graphene heat spreader. The hot spot temperature was decreased by about 5 degrees C at a heat flux of up to 800W/cm2. It is possible to further improve the thermal performance of graphene heat spreader by optimizing the synthesis parameters and transfer process.

Author

Zhaoli Gao

Yong Zhang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Matthew Yuen

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems

217-220

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

978-2-3550-0022-5

More information

Created

10/8/2017