Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Paper in proceedings, 2012
Monolayer graphene was fabricated using thermal CVD for the application of heat spreader in electronic packaging. Platinum (Pt) micro-heater embedded thermal testing chips were utilized to evaluate the thermal performance of the graphene heat spreader. The hot spot temperature was decreased by about 5 degrees C at a heat flux of up to 800W/cm2. It is possible to further improve the thermal performance of graphene heat spreader by optimizing the synthesis parameters and transfer process.
Author
Zhaoli Gao
Yong Zhang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Yifeng Fu
Matthew Yuen
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems
217-220
978-2-3550-0022-5 (ISBN)
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
978-2-3550-0022-5