Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Paper i proceeding, 2012

Monolayer graphene was fabricated using thermal CVD for the application of heat spreader in electronic packaging. Platinum (Pt) micro-heater embedded thermal testing chips were utilized to evaluate the thermal performance of the graphene heat spreader. The hot spot temperature was decreased by about 5 degrees C at a heat flux of up to 800W/cm2. It is possible to further improve the thermal performance of graphene heat spreader by optimizing the synthesis parameters and transfer process.

Författare

Zhaoli Gao

Yong Zhang

Chalmers, Teknisk fysik, Elektronikmaterial och system

Matthew Yuen

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems

217-220

Ämneskategorier

Annan elektroteknik och elektronik

ISBN

978-2-3550-0022-5

Mer information

Skapat

2017-10-08