Thermal Conduction of Fiber-Reinforced Polymer under Loading
Paper in proceeding, 2021
Thermal performance
Expoxy resin
Carbon fiber
Composite material
Author
Pei Lu
Shanghai University
Huihui Wang
Shanghai University
Yong Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
Y. Zhang
Shanghai University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
9780956808677 (ISBN)
Virtual, Online, Sweden,
Subject Categories
Polymer Chemistry
Polymer Technologies
Composite Science and Engineering