Graphene Heat Spreader for Thermal Management of Hot Spots
Paper in proceedings, 2013

Monolayer graphene was fabricated using thermal chemical vapor deposition (TCVD) as heat spreaders in electronic packaging. Platinum (Pt) thermal evaluation chips were utilized to evaluate the thermal performance of the graphene heat spreaders. Temperature of hot spot driven at a heat flux of up to 430W·cm -2 was decreased by about 13 °C with the attaching of the graphene heat spreader. We demonstrate the potentials of using CMOS compatible TCVD process to make graphene as heat spreader for power dissipation needs. © 2013 IEEE.

Author

Zhaoli Gao

Chalmers, Microtechnology and Nanoscience (MC2)

Yong Zhang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Matthew Yuen

Hong Kong University of Science and Technology

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the IEEE 2013 Electronic Components & Technology Conference

0569-5503 (ISSN)

2075-2078

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Subject Categories

Nano Technology

DOI

10.1109/ECTC.2013.6575865

ISBN

978-147990233-0

More information

Created

10/7/2017